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4th IEEE International Conference on Cloud Engineering (IC2E 2016) April 4-8, 2016, Berlin, Germany
Important Dates
Paper Submission (Extended): September 14, 2015 Author notification: December 5, 2015
The 4th IEEE International Conference on Cloud Engineering (IC2E) seeks to provide a high-quality and comprehensive forum, where researchers and practitioners can exchange information on engineering principles, enabling technologies, and practical experiences related to cloud computing. By bringing together experts that work on different levels of the cloud stack - systems, storage, networking, platforms, databases, and applications, IC2E offers an end-to-end view on the challenges and technologies in cloud computing, fosters research that addresses the interaction between different layers of the stack, and ultimately helps shape the future of cloud-transformed business and society.
We invite submissions of high-quality research papers describing fully developed results or on-going foundational and applied work related to all aspects of cloud engineering. The program committee will interpret ìcloud engineeringî very broadly - everything from engineering principles to practical experiences on different levels of the cloud stack. We particularly encourage submissions on topics of emerging interest in the research and development communities. We invite submissions on the following topics:
* Big data management, platforms and analytics
* Cloud applications and services
* Cloud programming models, benchmarks, and tools
* Cloud security, privacy, compliance, and trust
* Energy management in cloud centers
* Hybrid cloud integration
* Metering, pricing, and software licensing
* Mobile cloud computing
* Performance, dependability, and service level agreements
* Resource management and optimization in the cloud
* Service lifecycle management and automation
* Virtualization technology
* Workload deployment and migration
* X as a Service, where X includes Backend, Business Process, Database, Information, Infrastructure, Network, Platform, Security, Software, and Storage
Submission instructions
* Please submit full (and short) papers by September 14th, 2015 in PDF format via the web submission form at https://hotcrp.doc.ic.ac.uk/
* Full research track papers should not exceed 10 pages double column, including figures, tables, and references; short papers are limited to
6 pages. Short papers should be clearly marked as such in the title.
* Submissions must be in the standard IEEE format for conference proceedings - see the style templates for details:
Review process and publication
* All submitted manuscripts will be peer-reviewed. Submissions will be judged on correctness, originality, technical strength, significance, quality of presentation, and interest and relevance to the conference scope. Submitted manuscripts must contain original contributions, and their contributions must NOT have appeared in or be under consideration for publication in another workshop, conference, or journal.
* After review, some submissions may be offered to be published as a short paper (6 pages) or a poster (2 pages).
* Accepted papers will be published by the IEEE Computer Society Conference Publishing Services (EI indexed).
Organization
General Chairs
* Geoffrey Fox, Indiana University, USA
* Stefan Tai, TU Berlin, Germany
Program Committee Chairs
* Lucy Cherkasova, HP Labs, USA
* Peter Pietzuch, Imperial College London, UK
* Cho-Li Wang, University of Hong Kong, China
Program Committee
* Artur Andrzejak, Heidelberg University, Germany
* Danilo Ardagna, Politecnico di Milano, Italy
* Martin Arlitt, HP Labs, USA
* Jean Bacon, University of Cambridge, UK
* Novella Bartolini, University of Rome "Sapienza", Italy
* Sonia Ben Mokhtar, LIRIS-CNRS, France
* Sara Bouchenak, University of Grenoble, France
* Yerom-David Bromberg, University of Bordeaux 1, France
* Roy Campbell, University of Illinois at Urbana-Champaign, USA
* Giuliano Casale, Imperial College London, UK
* Abhishek Chandra, University of Minnesota, USA
* Haibo Chen, Shanghai Jiao Tong University, China
* Jinjun Chen, University of Technology Sydney, Australia
* Gregory Chockler, Royal Holloway University of London, UK
* Paolo Costa, Microsoft Research Cambridge, UK
* Dilma Da Silva, Texas A&M University, USA
* Eliezer Dekel, IBM Research Haifa, Israel
* Erik Elmroth, Umea University, Sweden
* Patrick Eugster, Purdue University, USA
* David Eyers, University of Otago, New Zealand
* Christof Fetzer, TU Dresden, Germany
* Jose Fortes, University of Florida, USA
* Ian Foster, University of Chicago, USA
* Xiaohui Gu, North Carolina State University, USA
* Indranil Gupta, University of Illinois at Urbana-Champaign, USA
* Seif Haridi, KTH Royal Institute of Technology/SICS, Sweden
* Bingsheng He, Nanyang Technological University, Singapore
* Ching-Hsien Hsu, Chung Hua University, Taiwan
* Jinho Hwang, IBM Research, USA
* Alex Iosup, Delft University of Technology, Netherlands
* Arun Iyengar, IBM Research, USA
* K. R. Jayaram, IBM Research, USA
* Hai Jin, Huazhong University of Science and Technology, China
* Ruediger Kapitza, TU Braunschweig, Germany
* Dejan Kostic, KTH Royal Institute of Technology, Sweden
* Philippe Lalanda, Universite Joseph Fourier, France
* Wolfgang Lehner, TU Dresden, Germany
* Baochun Li, University of Toronto, Canada
* Satoshi Matsuoka, Tokyo Institute of Technology, Japan
* Klara Nahrstedt, University of Illinois at Urbana-Champaign, USA
* Beng Chin Ooi, National University of Singapore, Singapore
* Manish Parashar, Rutgers University, USA
* Fernando Pedone, University of Lugano, Switzerland
* Guillaume Pierre, IRISA/University of Rennes 1, France
* Thomas Sandholm, EMC, USA
* Karsten Schwan, Georgia Tech, USA
* Marco Serafini, Qatar Computing Research Institute, Qatar
* Weisong Shi, Wayne State University, USA
* Liuba Shrira, Brandeis University, USA
* Evgenia Smirni, College of William and Mary, USA
* Stefan Tai, TU Berlin, Germany
* Francois Taiani, Universite de Rennes 1, France
* Jon Weissman, University of Minnesota, USA
* Dan Williams, IBM Research, USA
* Joel Wolf, IBM Research, USA
* Bernard Wong, University of Waterloo, Canada
* Timothy Wood, George Washington University, USA
* Yongwei Wu, Tsinghua University, China
* Cheng-Zhong Xu, Shenzhen Institutes of Advanced Technology, China
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